Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 926-931

  Kaisare, Abhijit ^a   Han, Zhenxue ^a   Agonafer, Dereje ^a   Ramakrishna, K ^b  

^a The University of Texas at Arlington   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Adhesive interface material; CTE mismatch; Heat sink attach; Reliability; Stress analysis; Thermo mechanical stresses; Wire bond plastic ball grid array (WB PBGA)

Indexed keywords

ADHESIVES; COMPUTER SIMULATION; DELAMINATION; EUTECTICS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); LEAD ALLOYS; PRINTED CIRCUIT BOARDS; SHEAR STRESS; SOLDERING ALLOYS; STRESS ANALYSIS; THERMAL EXPANSION;

PLASTIC BALL GRID ARRAYS;

HEAT SINKS;

EID: 0036459724     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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