Role of adhesive modulus on reliability of FCBGA with heat spreader

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 161-166

  Hsiao, Hsien Fu ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BALL GRID ARRAYS; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; FAILURE MODES; FINITE ELEMENT METHOD; GLASS TRANSITION; HEATING EQUIPMENT; MODIFIED ATMOSPHERE PACKAGING; PACKAGING; SPREADERS;

CONSTITUTIVE MATERIALS; FLIP CHIP BALL GRID ARRAY; PACKAGE DEVELOPMENT; POTENTIAL FAILURE MODES; RELIABILITY FAILURE; TEMPERATURE CYCLES; TEMPERATURE DEPENDENT; THERMO-MECHANICAL BEHAVIORS;

FLIP CHIP DEVICES;

EID: 84966692534     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188831     Document Type: Conference Paper

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