Predictive design of flip-chip PBGA for high reliability and low cost

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 1111-1115

  Mercado, Lei L ^a   Sarihan, Vijay ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLASTIC BALL GRID ARRAY; PREDICTIVE ENGINEERING; SURFACE MOUNTABLE PACKAGE;

COMPUTER SIMULATION; COSTS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; RELIABILITY; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

INTEGRATED CIRCUIT LAYOUT;

EID: 0032642318     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)