Study on reliability modeling for through hole cracking failure in thermal enhanced PBGA laminate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1658-1660

  Kobayashi, Tsuneo ^a   Hayashida, Sumito ^a  

^a IBM JAPAN LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; EPOXY RESINS; FAILURE (MECHANICAL); MATHEMATICAL MODELS; PLASTIC LAMINATES;

COFFIN-MANSON EQUATION; HOLE CRACKING FAILURE; RELIABILITY MODELING;

ELECTRONICS PACKAGING;

EID: 0034479504     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)