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Volumn 2, Issue , 2000, Pages 73-78
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Evaluation of die edge cracking in flip-chip PBGA packages
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACKS;
ELECTRONICS PACKAGING;
FINITE ELEMENT METHOD;
FRACTURE;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT TESTING;
RELIABILITY;
SEMICONDUCTING SILICON;
STRAIN RATE;
STRESS ANALYSIS;
SUBSTRATES;
BACKSIDE CRACKING;
DIE EDGE CRACKING;
FLIP CHIP PLASTIC BALL GRID ARRAY;
HORIZONTAL CRACKING;
SINGULATION PROCESS;
STRAIN ENERGY RELEASE RATE;
FLIP CHIP DEVICES;
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EID: 0033678227
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (7)
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References (15)
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