Plastic strain in thermally cycled flip-chip PBGA solderballs

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 239-244

  Drexler, E S ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON BEAMS; FLIP CHIP DEVICES; MOIRE FRINGES; PLASTICS APPLICATIONS; SOLDERING; STRAIN;

PLASTIC BALL GRID ARRAYS (PBGA); SOLDERBALLS;

ELECTRONICS PACKAGING;

EID: 0033323384     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)