Conversion of the under bump metallurgy into intermetallics: The impact on flip chip reliability

Microelectronics Reliability

Volumn 41, Issue 5, 2001, Pages 735-744

  Stepniak, Frank ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION; FAILURE ANALYSIS; INTERMETALLICS; RELIABILITY; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR GROWTH; SOLDERED JOINTS; SUBSTRATES;

UNDER BUMP METALLUGRY (UBM);

FLIP CHIP DEVICES;

EID: 0035340967     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00015-4     Document Type: Article

References (13)

1. Estimating flip chip reliability: Interactive, temperature-dependent failure mechanisms involving the under bump metallurgy
2. Calculation of stress in electrodeposits from the curvature of a plated strip
3. Solder flip chips employing electroless nickel: An evaluation of reliability and cost
4. Flip chip assembly on rigid organic laminates
5. Electromigration studies of flip chip bump solder joints
6. The influence of room temperature aging on ball shear strength and microstructure of area array solder balls
7. Influence of temperature on microelectronic and system reliability
8. Brittle interfacial fracture of PBGA packages soldered to electroless nickel/immersion gold
9. Solder metallization interdiffusion in microelectronic interconnects