Compact thermal model for transient temperature fields in electronic systems

2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002

Volumn , Issue , 2002, Pages 608-611

  Gerstenmaier, Y C ^a   Wachutka, G ^b  

^a SIEMENS AG   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

Compact thermal model; Multi chip module; Thermal interaction; Thermal modeling

Indexed keywords

ENERGY DISSIPATION; FINITE ELEMENT METHOD; INTEGRATION; MATHEMATICAL MODELS; MATRIX ALGEBRA; SYSTEMS ANALYSIS; THERMAL EFFECTS;

COMPACT THERMAL MODELS; MULTI-CHIP MODULES; THERMAL INTERACTION; THERMAL MODELING;

ELECTRONIC EQUIPMENT;

EID: 6344249369     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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