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Volumn , Issue , 1999, Pages 201-211

Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; ELECTRONICS PACKAGING; ERROR ANALYSIS; FINITE ELEMENT METHOD; HEAT RESISTANCE; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; SEMICONDUCTOR JUNCTIONS;

EID: 0032641940     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article
Times cited : (40)

References (7)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.