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Volumn , Issue , 1999, Pages 201-211
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Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods
a
a
SIEMENS AG
(Germany)
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Author keywords
[No Author keywords available]
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Indexed keywords
BOUNDARY CONDITIONS;
ELECTRONICS PACKAGING;
ERROR ANALYSIS;
FINITE ELEMENT METHOD;
HEAT RESISTANCE;
MATHEMATICAL MODELS;
MICROPROCESSOR CHIPS;
SEMICONDUCTOR JUNCTIONS;
BALL GRID ARRAYS (BGA);
QUAD FLAT PACKS (QFP);
INTEGRATED CIRCUIT TESTING;
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EID: 0032641940
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (40)
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References (7)
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