Transient temperature fields with general nonlinear boundary conditions in electronic systems

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 23-33

  Gerstenmaier, York C ^a   Wachutka, Gerhard K M ^b  

^a SIEMENS AG   (Germany)

^b TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

Muiti chip modules (MCMs); Nonlinear heat conduction with Green's function method; Radiative and convective boundary conditions; Thermal transient modeling

Indexed keywords

ALGORITHMS; APPROXIMATION THEORY; BOUNDARY CONDITIONS; GREEN'S FUNCTION; HEAT CONDUCTION; HEAT TRANSFER COEFFICIENTS; INTEGRAL EQUATIONS; ITERATIVE METHODS; MATHEMATICAL MODELS; MATRIX ALGEBRA; THERMAL EFFECTS; TIME DOMAIN ANALYSIS;

NONLINEAR BOUNDARY CONDITIONS; THERMAL TRANSIENT MODELING;

MULTICHIP MODULES;

EID: 15744377392     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.843186     Document Type: Article

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