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Volumn , Issue , 1998, Pages 518-523

Fast field solvers for thermal and electrostatic analysis

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROSTATIC ANALYSIS; MULTI-LAYERED; NODE REDUCTION; SIMULATION EXAMPLE; SOLVER TOOLS;

EID: 84893798800     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DATE.1998.655907     Document Type: Conference Paper
Times cited : (16)

References (8)
  • 1
    • 0031374728 scopus 로고    scopus 로고
    • Fast field solver programs for thermal and electrostatic analysis of microsystem elements
    • Nov. 9-13, San Jose, Ca, USA, Proc.
    • V. Székely, M. Rencz: Fast field solver programs for thermal and electrostatic analysis of microsystem elements, ICCAD97 Int. Conf. on Computer-Aided Design, Nov. 9-13 1997, San Jose, Ca, USA, Proc. pp.684-689
    • (1997) ICCAD97 Int. Conf. on Computer-Aided Design , pp. 684-689
    • Székely, V.1    Rencz, M.2
  • 2
    • 0030412849 scopus 로고    scopus 로고
    • S thermanal: An efficient thermal simulation tool for microsystem elements and mcms
    • 14-15 October, Austin, Texas, USA, SPIE Proc
    • V. Székely, A. Csendes, M. Rencz: S-THERMANAL: An efficient thermal simulation tool for microsystem elements and MCMs. SPIE96 Symposium on Micromachining and Microfabrication, 14-15 October 1996, Austin, Texas, USA, SPIE Proc. Vol. 2880, pp. 64-75.
    • (1996) SPIE96 Symposium on Micromachining and Microfabrication , vol.2880 , pp. 64-75
    • Székely, V.1    Csendes, A.2    Rencz, M.3
  • 3
    • 0016127309 scopus 로고
    • Thermal analysis of multiple-layer structures
    • A.G. Kokkas: Thermal analysis of multiple-layer structures, IEEE Trans. on El. Dev., V. ED-21, No. 11, pp. 674-681 (1974)
    • (1974) IEEE Trans. on El. Dev., v , vol.ED-21 , Issue.11 , pp. 674-681
    • Kokkas, A.G.1
  • 4
    • 0005297351 scopus 로고
    • Graphical computer methods in the design of integrated circuits
    • V. Székely, P. Baji, M. Rencz: Graphical computer methods in the design of integrated circuits, Periodica Polytechnica, V. 23, No. 3-4, pp. 331-338 (1979)
    • (1979) Periodica Polytechnica , vol.23 , Issue.3-4 , pp. 331-338
    • Székely, V.1    Baji, P.2    Rencz, M.3
  • 5
    • 0025545812 scopus 로고
    • Novel tools for thermal and electrical analysis of circuits
    • V. Székely, A. Poppe: Novel tools for thermal and electrical analysis of circuits, Electrosoft, V. 1. No. 4. pp. 234-252 (1990)
    • (1990) Electrosoft , vol.1 , Issue.4 , pp. 234-252
    • Székely, V.1    Poppe, A.2
  • 6
    • 0021405731 scopus 로고
    • Chip substrate resistance modeling technique for integrated circuit design
    • T. A. Johnson, R. W. Knepper, V. Marcello and W. Wang: Chip substrate resistance modeling technique for integrated circuit design, IEEE Trans. on Computer-Aided Design, Vol.CAD-3, No.2, pp. 126-134 (1984)
    • (1984) IEEE Trans. on Computer-Aided Design , vol.CAD-3 , Issue.2 , pp. 126-134
    • Johnson, T.A.1    Knepper, R.W.2    Marcello, V.3    Wang, W.4
  • 8
    • 84893732530 scopus 로고
    • Double hetero structure InP/GaInAsP laser diode with double channel substrate, built-in reverse-biased pn junction and buried active layer
    • I. Habermajer, Ö.Lendvay, Z.Lábadi and V.Rakovics: Double hetero structure InP/GaInAsP laser diode with double channel substrate, built-in reverse-biased pn junction and buried active layer, Hungarian Patent No. 206 565., 1988
    • (1988) Hungarian Patent , Issue.206-565
    • Habermajer, I.1    Lendvay, Ö.2    Lábadi, Z.3    Rakovics, V.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.