Effects of Al content on the electrical properties of LaxAl yOz films grown on TiN substrate by atomic layer deposition

Applied Physics Letters

Volumn 90, Issue 10, 2007, Pages

  Kim, Su Young ^a   Kwon, Hyuk ^a   Jo, Sang Jin ^a   Ha, Jeong Sook ^a   Park, Won Tae ^a   Kang, Dong Kyun ^a   Kim, Byong Ho ^a  

^a Korea University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC LAYER DEPOSITION; CURRENT DENSITY; FILM GROWTH; LANTHANUM COMPOUNDS; LEAKAGE CURRENTS; SEMICONDUCTING ALUMINUM COMPOUNDS; TITANIUM NITRIDE;

LEAKAGE CURRENT DENSITY; OXIDE THICKNESS; POSTANNEALING;

THIN FILMS;

EID: 33947113495     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2709951     Document Type: Article

References (13)

1. S.-W. Jeong, H. J. Lee, K. S. Kim, M. T. You, Y. Roh, T. Noguchi, W. Xianyu, and J. Jung, Thin Solid Films 515, 526 (2006).
2. C. Zhu, B.-J. Cho, and M.-F. Li, Chem. Vap. Deposition 12, 165 (2006).
3. V. Capodieci, F. Wiest, T. Sulima, J. Schulze, and I. Eisele, Microelectron. Reliab. 45, 937 (2005).
4. R. S. Johnson, G. Lucovsky, and I. Baumvol, J. Vac. Sci. Technol. A 19, 1353 (2001).
5. J. E. Jaffe, C. L. Liu, M. Stoker, R. I. Hegde, R. S. Rai, and P. J. Tobin, Appl. Phys. Lett. 80, 1897 (2002).
6. G. D. Wilk, R. M. Wallace, and J. M. Anthony, J. Appl. Phys. 89, 5243 (2001).
7. V. Edon, M. C. Hugon, B. Agius, L. Miotti, C. Radtke, F. Tatsch, J. J. Ganem, I. Trimaille, and I. J. R. Baumvol, Appl. Phys. A: Mater. Sci. Process. 83, 289 (2006).
8. M.-H. Cho, Y. S. Rho, C. N. Whang, K. Jeong, H. J. Choi, S. W. Nam, D.-H. Ko, J. H. Lee, N. I. Lee, and K. Fujihara, Appl. Phys. Lett. 81, 1071 (2002).
9. H. Y. Yu, N. Wu, M. F. Li, C. Zhu, B. J. Cho, D.-L. Kwong, C. H. Tung, J. S. Pan, J. W. Chai, W. D. Wang, D. Z. Chi, C. H. Ang, J. Z. Zheng, and S. Ramanathan, Appl. Phys. Lett. 81, 3618 (2002).
10. B. S. Lim, A. Rahtu, P. de Rouffignac, and R. G. Gordon, Appl. Phys. Lett. 84, 3957 (2004).
11. N. K. Park, D. K. Kang, B.-H. Kim, S. J. Jo, and J. S. Ha, Appl. Surf. Sci. 252, 8506 (2006).
12. M. Shahjahan, T. Okada, K. Sawada, and M. Ishida, Jpn. J. Appl. Phys., Part 1 43, 5404 (2004).
13. V. Mikhelashvili and G. Eisenstein, Thin Solid Films 515, 346 (2006).