Nickel displacement deposition of porous silicon with ultrahigh aspect ratio

Journal of the Electrochemical Society

Volumn 154, Issue 3, 2007, Pages

  Xu, Chengkun ^a,b   Zhang, Xi ^a   Tu, King Ning ^a   Xie, Yahong ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVE COUMARIN; MASS TRANSPORT; PLATING BATH CHEMISTRY; ULTRAHIGH ASPECT RATIO;

ADDITIVES; ASPECT RATIO; CONCENTRATION (PROCESS); DEPOSITION; NICKEL; PH;

POROUS SILICON;

EID: 33846987242     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2430690     Document Type: Article

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