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Volumn 10, Issue 2, 2007, Pages

Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-x gex films

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; DIFFUSION; GERMANIUM COMPOUNDS; GRAIN BOUNDARIES; NICKEL; SILICA;

DEALLOYING; GERMANOSILICIDES; GROOVE ANGLE; SILICIDES; SOLID STATE REACTIONS;

THIN FILMS;

EID: 33845921497 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.2400726 Document Type: Article

Times cited : (10)

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