SCOPUS 정보 검색 플랫폼

Volumn 17, Issue 2, 1999, Pages 251-258

Electrochemical investigation on the effect of silver addition on wettability of Sn-Zn system lead-free solder

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC POLARIZATION; COPPER; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; SILVER; TIN ALLOYS; WETTING; ZINC ALLOYS;

CONTACT CURRENT; CONTACT POLARIZATION; LEAD FREE SOLDER; SOLDERING FLUX; WETTABILITY;

SOLDERING ALLOYS;

EID: 0032631710 PISSN: 02884771 EISSN: None Source Type: None
DOI: 10.2207/qjjws.17.251 Document Type: Article

Times cited : (21)

References (15)

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3
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6
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7
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- Electrochem. Pub., Scotland
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8
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- Wetting behaviour of eutectic tin/lead solder and fluxes on copper surfaces
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9
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- A Model of the Solder Flux Reaction ; Reactions at the Metal/Metal Oxide/Electrolyte Solution Interface
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- Nasta, M.¹ Peebles, H.C.²

10
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- Solderability assessment via sequential electrochemical reduction analysis
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12
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13
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- Corrosion and Passivity of Some Pb-Sn Alloys in Media of Different pH
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14
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.