Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Materials Science and Engineering: A

Volumn 429, Issue 1-2, 2006, Pages 36-42

  Chang, Tao Chih ^a   Chou, Shih Min ^a   Hon, Min Hsiung ^a,b   Wang, Moo Chin ^c,d  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b DA YEH UNIVERSITY   (Taiwan)

^c NATIONAL UNITED UNIVERSITY   (Taiwan)

^d KAOHSIUNG MEDICAL UNIVERSITY   (Taiwan)

Author keywords

Adhesion strength; Flux; Liquidus temperature; Microstructure; Sn 9Zn xAg Lead free solders

Indexed keywords

ADHESION; COPPER; HEAT TREATMENT; INTERFACES (MATERIALS); SOLDERING ALLOYS; SUBSTRATES; WETTING;

ADHESION STRENGTH; LEAD-FREE SOLDERS; LIQUIDUS TEMPERATURE;

TIN ALLOYS;

ADHESION; COPPER; HEAT TREATMENT; INTERFACES (MATERIALS); SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; WETTING;

EID: 33745938339     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.04.093     Document Type: Article

References (23)

1. Subramanian K.S., Sastri V.S., Elboujdaini M., Connor J.W., and Davey A.B.C. Water Res. 29 (1995) 1827-1836
2. L.J. Turbini, W.R. Bent, W.J. Ready, SMTA Int., Chicago, IL, Sep. 2000, Surface Mount Technology Association, Edina, MN, 2000, pp. 20-24.
3. Miller C.M., Anderson I.E., and Jin S. J. Electron. Mater. 23 (1994) 595-602
4. Yu S.P., Lin H.J., Hon M.H., and Wang M.C. J. Mater. Sci.: Mater. Electron. 11 (2000) 461-471
5. McCormack M., Jin S., Kammlott G.W., and Chen H.S. Appl. Phys. Lett. 63 (1993) 15-17
6. Yu S.P., Hon M.H., and Wang M.C. J. Electron. Mater. 29 (2000) 237-243
7. Sigelko J., Choi S., Subramanian K.N., Lucas J.P., and Bieler T.R. J. Electron. Mater. 28 (1999) 1184-1188
8. McCormack M., and Ji S. J. Electron. Mater. 23 (1994) 635-640
9. Glazer J. Int. Mater. Rev. 40 (1995) 65-93
10. Yu S.P., Liao C.L., Hon M.H., and Wang M.C. J. Mater. Sci. 35 (2000) 1-8
11. Takemoto T., Funaki T., and Matsunawa A. Jpn. J. Weld. Soc. 17 (1999) 251-258
12. Chang T.C., Wang M.C., and Hon M.H. J. Electron. Mater. 32 (2003) 516-522
13. Chen K.I., and Lin K.L. J. Electron. Mater. 31 (2002) 861-867
14. Song J.M., Lan G.F., Lui T.S., and Chen L.H. Scripta Mater. 48 (2003) 1047-1051
15. Vianco P.T., and Rejent J.A. J. Electron. Mater. 28 (1999) 1127-1137
16. Lee B.J., Hwang N.M., and Lee H.M. Acta Mater. 45 (1997) 1867-1874
17. Chada S., Fournelle R.A., Laub W., and Shangguan D. J. Electron. Mater. 29 (2000) 1214-1221
18. Shohji I., Nakamura T., Mori F., and Fujiuchi S. Mater. Trans. 43 (2002) 1797-1801
19. Suganuma K., Murata T., Noguchi H., and Toyoda Y. J. Mater. Res. 15 (2000) 884-891
20. Chang T.C., Hon M.H., and Wang M.C. Electrochem. Solid-State Lett. 7 (2004) J4-J8
21. Sancaktar E., and Gomatam R. J. Adhes. Sci. Technol. 15 (2001) 97-117
22. Kim M.I., Moon J.K., and Jung J.P. Mater. Trans. 43 (2002) 1791-1796
23. Chang T.C., Wang M.C., and Hon M.H. J. Cryst. Growth 236 (2004) 223-231