Laser-assisted bump transfer for flip chip assembly

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 86-90

  Wang, C H ^a   Holmes, A S ^b   Gao, S ^b  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; GOLD DEPOSITS; MODIFIED ATMOSPHERE PACKAGING; POLYIMIDES; WAFER BONDING;

BONDING LAYERS; BUMP SHEAR TEST; FLIP CHIP ASSEMBLIES; LASER MACHINING; LASER-ASSISTED; POLYIMIDE LAYERS; UV LITHOGRAPHY; VISUAL INSPECTION;

CHIP SCALE PACKAGES;

EID: 0012040420     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904137     Document Type: Conference Paper

References (10)

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