Novel Low-Cost Sol-Gel Derived Materials for Nano-Structured and Repairable Interconnects

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 943-948

  Aggarwal, Ankur O ^a   Abothu, Isaac R ^a   Raj, P Markondeya ^a   Ravi, D ^a   Sacks, Michael D ^a,b   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE RESISTANCE; MECHANICAL RELIABILITY; REPAIRABLE INTERCONNECTS; SOL-GEL TECHNOLOGY;

CRACK PROPAGATION; ELECTRIC PROPERTIES; ELECTROPLATING; INDUSTRIAL APPLICATIONS; NANOSTRUCTURED MATERIALS; ORGANOMETALLICS; PYROLYSIS; RELIABILITY; SOL-GELS; SOLDERING ALLOYS;

INTEGRATED CIRCUITS;

EID: 2342558037     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. International Technology Roadmap for Semiconductors - Assembly and packaging (2001 edition); http://public.itrs.net/Files/2001ITRS/Assem bly.pdf
2. A. O. Aggarwal, P. M. Raj, R. J. Pratap, A. Saxena, R. R. Tummala; "Design and Fabrication of High Aspect Ratio Fine Pitch Interconnects for Wafer Level Packaging"; EPTC 2002
3. L.L. Ye, Z. H. Lai, J. Liu and A. Thölen; "Recent achievement in microstructure investigation of Sn0.5Cu3.5Ag lead-free alloy by adding boron and zirconium"; Proceedings of the IMAPS/IEEE-CPMT 4th Symposium on Materials in Electronic Packaging, March 15-17th, 1999, Braselton, GA, USA, pp. 262-267
4. Sol-gel science: the physics and chemistry of sol-gel processing; C. Jeffrey Brinker, George W. Scherer; Boston: Academic Press, c1990
5. C.M. Hong, X. Sun, S. Wagner, S.Y.Chou; "High Resolution Copper lines by direct imprinting"; Materials Research Society Proceedings, Vol. 624
6. Thermodynamic properties of elements and oxides; L.B. Pankratz; U.S. Dept. of the Interior, Bureau of Mines (1982); Bulletin 672