A low cost bumping method for flip chip assembly and MEMS integration

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 171-176

  Zhang, J H ^a   Wang, C H ^b   Pang, A J ^b   Zeng, J ^b  

^a SHANGHAI UNIVERSITY   (China)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTROFORMING; FLIP CHIP DEVICES; GOLD; INTEGRATED CIRCUIT LAYOUT; MICROELECTROMECHANICAL DEVICES; NICKEL; PHOTOLITHOGRAPHY; SCANNING ELECTRON MICROSCOPY; SENSORS;

BONDING STRENGTH; DEIONIZED WATER; THERMOCOMPRESSION BONDING; WAFER BUMPING METHOD;

ELECTRONICS PACKAGING;

EID: 14844320107     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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