Drop impact reliability analysis of CSP packages at board and product system levels through modeling approaches

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 296-303

  Zhu, Liping ^a   Marcinkiewicz, Walt ^a  

^a ERICSSON RESEARCH   (United States)

Author keywords

CSP BGA; Drop impact modeling; FEA

Indexed keywords

BALL GRID ARRAY (BGA) PACKAGES; MULTI-COMPONENT BOARDS;

DATA ACQUISITION; FAILURE (MECHANICAL); INTEGRATED CIRCUITS; PORTABLE EQUIPMENT; PRINTED CIRCUIT BOARDS; RELIABILITY;

CHIP SCALE PACKAGES;

EID: 4444260041     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. JESD22-B111, "Board Level Drop Test Method of Components for Handheld Electronic Products," JEDEC Solid State Technology Association, July 2003.
2. L.P. Zhu, "Submodeling Technique for BGA Reliability Analysis of CSP Packaging Subjected to an Impact Loading," Proc of InterPACK'2001, Kauai, Hawaii, July 2001.
3. Q. Yu, et al, "Dynamic Behavior of Electronics Package and Impact Reliability of BGA Solder Joints," Proceedings of ITherm' 2002, pp1232.
4. rd ECTC Conference Proceedings, 2003.
5. X.Q. Shi, et al, "Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy," Journal of Electronic Packaging, Vol. 121, 1995, pp.179-185.
6. L.H. Dai and S-W R. Lee, "Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy," Proc of InterPACK'2001, Kauai, Hawaii, July 2001.
7. J.O. Hallquist, LS-DYNA Users Manual, LSTC, 1998.