Drop-impact reliability of chip-scale packages in handheld products

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 135-143

  Tian, Guoyun ^a   Liu, Yueli ^a   Lall, Pradeep ^a   Wayne Johnson, R ^a   Abderrahman, Sanan ^a   Palmer, Mike ^a   Islam, Nokib ^a   Panchgade, Dhananjay ^a   Suhling, Jeffrey ^a   Crane, Larry ^b  

^a AUBURN UNIVERSITY   (United States)

^b Henkel Loctite Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; DEHYDRATION; FLIP CHIP DEVICES; IMPACT TESTING; LAMINATES; PORTABLE EQUIPMENT; SHOCK TESTING; SOLDERING; STRENGTH OF MATERIALS;

DROP-IMPACT TESTING; FLIP CHIP ON LAMINATE (FCOL);

CHIP SCALE PACKAGES;

EID: 11144355689     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42075     Document Type: Conference Paper

References (9)

1. Clech., J-P., "Solder Reliability Solutions: a PC-based Design-for-reliability Tool," Proceedings of the Surface Mount International Conference, Sept. 8-12, San Jose, CA, Vol. I, pp. 136-151, 1996.
2. Clech, J-P., "Flip-chip /CSP Assembly Reliability and Solder Volume Effects", Proceedings of the Surface Mount International Conference, San Jose, CA, August 25-27, 1998, pp. 315-324.
3. Hannan, Nael, Puligandla Viswanadham, Larry Crane, Erin Yaeger, Afranio Torres, and R. Wayne Johnson, "Reworkable Underfill Materials For Improved Manufacturability And Reliability Of CSP Assemblies," Proceedings of the 2001 APEX Conference, San Diego, CA, January 14-18, 2001, pp. AT8-3-1 - AT8-3-10.
4. Houghton, Bruce, "Solving the ENIG Black Pad Problem: An ITRI Report on Round 2," Proceedings of IPC Works '99, Oct. 23-28, 1999, Minneapolis, MN, pp. S-04-3-1 to S-04-3-9.
5. Lall, P., and K. Banerji, "Assembly-Level Reliability of Flex-Substrate BGA, Elastomer-on-Flex Packages, and 0.5 mm Pitch Partial Array Packages," Microelectronics Reliability Journal, Vol. 40, pp. 1081-1095, 2000
6. Liu, Jing, R. Wayne Johnson, Erin Yaeger, Mark Konarski and Larry Crane, "CSP Underfill, Processing and Reliability," Proceedings of the 2002 APEX Technical Program, January 19-24, 2002, San Diego, CA, pp. S16-1-1 to S16-1-7.
7. Loctite 3515 Datasheet www.loctite.com/datasheets/tds/Product_3515.pdf
8. Peng, Haiwei, R. Wayne Johnson, George Flowers, Erin Yeager, Mark Konarski, Afranio Torres, and Larry Crane, "Underfilling Micro-BGAs," Proceedings of the International Conference on High-Density Interconnect and Systems Packaging, Denver CO, April 25-28, 2000, pp. 134-140.
9. Young, Steven J., "Underfilling BGA and CSP for Harsh Environment Deployment," Proceedings of the 1999 International Conference on High Density Packaging and MCMs, Denver, CO, April 7-9, 1999.