Investigation of different options of pre-applied CSP underfill for mechanical reliability enhancements in mobile phones

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 770-774

  Hannan, Nael ^a   Kujala, Arni ^a   Mohan, Vinod ^b   Morganelli, Paul ^b   Shah, Jayesh ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b Emerson and Cuming Company   (United States)

Author keywords

And chip scale package; Assembly process; Drop testing; Mechanical shock reliability; Pre applied chip scale package underfill; Reworkable underfill

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; MOBILE TELECOMMUNICATION SYSTEMS; MOISTURE; PRINTED CIRCUIT BOARDS; RELIABILITY; STRESS ANALYSIS;

ASSEMBLY PROCESS; DROP TESTING; MECHANICAL SHOCK RELIABILITY; PRE-APPLIED CHIP SCALE PACKAGE UNDERFILL; REWORKABLE UNDERFILL;

CHIP SCALE PACKAGES;

EID: 10444220142     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. R. Ghaffarian, Ph.D., N.P. Kim, Ph.D., CSP Assembly Reliability and Effects of Underfill and Double-Sided Population, 2000 ECTC, pp 390-396
2. Q.Yu, H. Kikuchi, S. Ikeda, M. Shiratori, M. Kakine, N. Fujiwara, "Dynamic Behavior of Electronics Package and Impact Reliability of BGA Solder Joints", 2002 Inter Society Conference on Thermal Phenomena, pp 953-9603.
3. P. Morganelli, Ph.D., R. Frimanson, M. Laffey, D. Katze, "NonEpoxy-Based Underfill for CSP Assembly", 2003 IMAPS, Boston,
4. N. Hannan, Puligandla Viswanadham, "Critical Aspects of Reworkable Underfill for Portable Consumer Products", ECTC 2001
5. A. Kujala, T. Reinikainen, W. Ren, "Transition to Pb-free Manufacturing Using Land Grid Array Packaging Technology", ECTC 2002, pp 359-364
6. S. Goyal, S. Upasani, and D. Patel, "The Role of Case-Rigidity in Drop-Tolerance of Portable Products", International Journal of Microcircuits & Electronic Packaging (IMAPS), Second Quarter 1999, Volume 22 Number 2, pp. 175-183
7. L. Leicht and A. Skipor "Mechanical Cycling Fatigue of PBGA Package Interconnects" Proceedings of the 1998 International Microelectronics and Packaging Symposium (IMAPS), 1998.