Effect of intermetallic phases on performance in a mechanical drop environment: 96.5Sn3.5Ag solder on Cu and Ni/Au pad finishes

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1288-1295

  Saha, Sambit K ^a   Mathew, Sesil ^a   Canumalla, Sridhar ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLIC PHASE GROWTH; LEAD FREE SOLDERS; MECHANICAL DROP TEST; VOID CONTACTS;

COPPER; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINISHING; INTERMETALLICS; MECHANICAL TESTING; NICKEL; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; SOLDERED JOINTS; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 10444257234     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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