메뉴 건너뛰기




Volumn 1, Issue , 2004, Pages 1047-1054

Mechanical shock testing and modeling of PC motherboards

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT BOARDS; MECHANICAL SHOCK TESTING; MOTHERBOARDS; SHOCK RESPONSE SPECTRUM (SRS);

EID: 10444237957     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (72)

References (26)
  • 1
    • 0026619628 scopus 로고
    • PWB solder joint fatigue life calculations under thermal and vibrational loading
    • January
    • Barker, Donald B., Abhijit Dasgupta, Michael G. Pecht, "PWB Solder Joint Fatigue Life Calculations Under Thermal and Vibrational Loading," Journal of the IES, Vol. 35, no. 1, pp 17-25, January 1992.
    • (1992) Journal of the IES , vol.35 , Issue.1 , pp. 17-25
    • Barker, D.B.1    Dasgupta, A.2    Pecht, M.G.3
  • 2
    • 0034290962 scopus 로고    scopus 로고
    • Using analysis for drop or other shock environments
    • Oct.
    • Deiters, T., Baker, M., Indermuehle, K, and Engelhart, C., (2000) "Using Analysis for Drop or Other Shock Environments," Sound and Vibration, V 34, N 10, Oct., pp. 26-30.
    • (2000) Sound and Vibration , vol.34 , Issue.10 , pp. 26-30
    • Deiters, T.1    Baker, M.2    Indermuehle, K.3    Engelhart, C.4
  • 5
    • 0036292713 scopus 로고    scopus 로고
    • Effect of strain rate on solder joint failure under mechanical load
    • San Diego, CA, May
    • nd ECTC, San Diego, CA, May.
    • (2002) nd ECTC
    • Geng, P.1    Chen, P.2    Ling, Y.3
  • 8
  • 9
    • 0009599708 scopus 로고
    • United States Nuclear Regulatory Commission
    • Nuclear Regulatory Commission, 1976, Regulatory Guide 1.92, Rev 1, United States Nuclear Regulatory Commission.
    • (1976) Regulatory Guide 1.92, Rev 1
  • 10
    • 84954042925 scopus 로고    scopus 로고
    • Comparison of mechanical response of PCB's subjected to product-level and board-level drop impact tests
    • Singapore, Dec.
    • Ong, Y.C., Shim, V.P.W., Chai, T.C., and Lim, C.T., (2003), "Comparison of Mechanical Response of PCB's subjected to Product-Level and Board-Level Drop Impact Tests," 5th Electronics Packaging Conference, Singapore, Dec., pp 223-227.
    • (2003) 5th Electronics Packaging Conference , pp. 223-227
    • Ong, Y.C.1    Shim, V.P.W.2    Chai, T.C.3    Lim, C.T.4
  • 11
    • 0009616606 scopus 로고
    • Optimal support locations for circuit cards populated with modules
    • Atlanta, Ga., December 1-6, paper no. 91-WA-EEP-2
    • Pitarresi, J.M. and Di Edwardo, A.,(1991), "Optimal Support Locations for Circuit Cards Populated with Modules," ASME Winter Conference, Atlanta, Ga., December 1-6, paper no. 91-WA-EEP-2.
    • (1991) ASME Winter Conference
    • Pitarresi, J.M.1    Di Edwardo, A.2
  • 12
    • 0009554003 scopus 로고
    • Comparison of vibration modeling techniques for printed circuit cards
    • Atlanta, Ga., December 1-6, paper no. 91-WA-EEP-34
    • Pitarresi, J.M. and Primavera, A., (1991), "Comparison of Vibration Modeling Techniques for Printed Circuit Cards," ASME Winter Conference, Atlanta, Ga., December 1-6, paper no. 91-WA-EEP-34.
    • (1991) ASME Winter Conference
    • Pitarresi, J.M.1    Primavera, A.2
  • 13
    • 0025638167 scopus 로고
    • Modeling of printed circuit cards subject to vibration
    • New Orleans, LA, May 3-5
    • Pitarresi, J.M., "Modeling of Printed Circuit Cards Subject to Vibration", IEEE Proceedings of the Circuits and Systems Conference, New Orleans, LA, May 3-5, 1990, pp. 2104-2107.
    • (1990) IEEE Proceedings of the Circuits and Systems Conference , pp. 2104-2107
    • Pitarresi, J.M.1
  • 14
    • 0026220770 scopus 로고
    • The smeared properties approach to FE vibration modeling of printed circuit cards
    • September
    • Pitarresi, J.M., Celetka, D., Coldwel, R. and Smith, D., (1991), "The Smeared Properties Approach to FE Vibration Modeling of Printed Circuit Cards," ASME Journal of Electronics Packaging, Vol. 113, September, pp. 250-257.
    • (1991) ASME Journal of Electronics Packaging , vol.113 , pp. 250-257
    • Pitarresi, J.M.1    Celetka, D.2    Coldwel, R.3    Smith, D.4
  • 15
    • 0026989242 scopus 로고
    • Comparison of vibration modeling techniques for printed circuit cards
    • December
    • Pitarresi, J.M. and Primavera, A., (1992) "Comparison of Vibration Modeling Techniques for Printed Circuit Cards," ASME Journal of Electronics Packaging, Vol. 114, December, pp. 378-383.
    • (1992) ASME Journal of Electronics Packaging , vol.114 , pp. 378-383
    • Pitarresi, J.M.1    Primavera, A.2
  • 16
    • 0027764005 scopus 로고
    • Random vibration response of a surface mounted lead/solder joint
    • Binghamton, NY, Sept
    • Pitarresi, J.M. and Akanda, A., (1993), "Random Vibration Response of a Surface Mounted Lead/Solder Joint," Proc. ASME International Electronics Packaging Conference, Vol 1, Binghamton, NY, Sept, pp. 207-217.
    • (1993) Proc. ASME International Electronics Packaging Conference , vol.1 , pp. 207-217
    • Pitarresi, J.M.1    Akanda, A.2
  • 18
    • 10444285597 scopus 로고    scopus 로고
    • Shell-Based Simplified electronic Package Model Development and its Application for Reliability Analysis
    • Singapore, Dec.
    • Ren, W. and Wang, J., (2003), "Shell-Based Simplified electronic Package Model Development and its Application for Reliability Analysis," 5th Electronics Packaging Conference, Singapore, Dec., pp 217-222.
    • (2003) 5th Electronics Packaging Conference , pp. 217-222
    • Ren, W.1    Wang, J.2
  • 19
    • 0009599948 scopus 로고    scopus 로고
    • Basis for Intel Mechanical Shock Requirements
    • Shah, K., (1999), "Basis for Intel Mechanical Shock Requirements," Intel Assembly and Test Technology Journal, V 2, pp. 1-6.
    • (1999) Intel Assembly and Test Technology Journal , vol.2 , pp. 1-6
    • Shah, K.1
  • 24
    • 2942723277 scopus 로고    scopus 로고
    • Drop test and impact life prediction model for QFN packages
    • Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., and Zhong, Z., (2003), "Drop Test and Impact Life Prediction Model for QFN Packages," Journal SMT, Vol 16, Issue 3, pp 31-39.
    • (2003) Journal SMT , vol.16 , Issue.3 , pp. 31-39
    • Tee, T.Y.1    Ng, H.S.2    Lim, C.T.3    Pek, E.4    Zhong, Z.5
  • 25
    • 84954039444 scopus 로고    scopus 로고
    • Design for enhanced solder joint reliability of integrated passive devices under board level drop test and thermal cycling test
    • Singapore, Dec.
    • Tee, T.Y., Ng, H. S., and Zhong, Z., (2003), "Design for Enhanced Solder Joint Reliability of Integrated Passive Devices under Board Level Drop Test and Thermal Cycling Test,", 5th Electronics Packaging Conference, Singapore, Dec., pp. 210 - 216.
    • (2003) 5th Electronics Packaging Conference , pp. 210-216
    • Tee, T.Y.1    Ng, H.S.2    Zhong, Z.3
  • 26
    • 36249022907 scopus 로고    scopus 로고
    • Numerical studies of the mechanical response of solder joint to drop/impact load
    • Singapore, Dec.
    • Xu, L., Wang, J., Reinikainen, T., Han, Z.X., and Wang, B.P., (2003), "Numerical Studies of the Mechanical Response of Solder Joint to Drop/Impact Load," 5th Electronics Packaging Conference, Singapore, Dec. , pp 228-232.
    • (2003) 5th Electronics Packaging Conference , pp. 228-232
    • Xu, L.1    Wang, J.2    Reinikainen, T.3    Han, Z.X.4    Wang, B.P.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.