The effect of Co-planarity variation on anisotropic conductive adhesive assemblies

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 932-938

  Dou, Guangbin ^a   Whalley, David C ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; CURING; ROTATION; SELF ASSEMBLY; SUBSTRATES;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); BOND THICKNESS; JOINT RESISTANCES; POLYMER ADHESIVE MATRIX; SUBSTRATE TERMINATIONS;

CONDUCTIVE FILMS;

EID: 33845572320     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645766     Document Type: Conference Paper

References (18)

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