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Volumn 18, Issue 1, 2006, Pages 3-10

RLC effects in fine pitch anisotropic conductive film connections

Author keywords

Capacitance; Dielectric properties; Electrical conductivity; Frequencies; Inductance

Indexed keywords

ANISOTROPIC CONDUCTIVE FILM (ACF); DIGITAL OSCILLOSCOPES;

EID: 33644521747     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610647062     Document Type: Article
Times cited : (8)

References (10)
  • 3
    • 0347567445 scopus 로고    scopus 로고
    • Electrical conduction characteristics of anisotropic conductive adhesive particles
    • Dou, G.B., Chan, Y.C. and Liu, J. (2003), “Electrical conduction characteristics of anisotropic conductive adhesive particles”, Journal of Electronic Packaging, Transactions of the ASME, Vol. 125, pp. 609-16.
    • (2003) Journal of Electronic Packaging, Transactions of the ASME , vol.125 , pp. 609-616
    • Dou, G.B.1    Chan, Y.C.2    Liu, J.3
  • 6
    • 0034756372 scopus 로고    scopus 로고
    • ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges
    • Liu, J. (2001), “ACA bonding technology for low cost electronics packaging applications – current status and remaining challenges”, Soldering & Surface Mount Technology, Vol. 13 No. 3, pp. 39-57.
    • (2001) Soldering & Surface Mount Technology , vol.13 , Issue.3 , pp. 39-57
    • Liu, J.1
  • 8
    • 0034273631 scopus 로고    scopus 로고
    • High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm
    • Ryu, W., Jin, M., Ahm, S., Lee, J., Kim, W., Paik, K.W. and Kim, J. (2000), “High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm”, IEEE Transactions On Components and Packaging Technology, Vol. 23 No. 3, pp. 542-5.
    • (2000) IEEE Transactions On Components and Packaging Technology , vol.23 , Issue.3 , pp. 542-545
    • Ryu, W.1    Jin, M.2    Ahm, S.3    Lee, J.4    Kim, W.5    Paik, K.W.6    Kim, J.7


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.