Assembly of planar array components using anisotropic conducting adhesives - a benchmark study: Part II - theory

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 19, Issue 4, 1996, Pages 264-269

  Mannan, Samjid H ^a   Whalley, David C ^a   Ogunjimi, Adebayo Oluyinka ^a   Williams, David J ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COMPUTATIONAL FLUID DYNAMICS; CONDUCTIVE PLASTICS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; PLASTIC ADHESIVES;

ANISOTROPIC CONDUCTIVE ADHESIVE (ACA) MATERIALS; BALL GRID ARRAY (BGA) PACKAGE STRUCTURES; CHIP SCALE PACKAGING (CSP); FLIP CHIP ASSEMBLY;

ELECTRONICS PACKAGING;

EID: 0030257742     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.558553     Document Type: Article

References (6)

1. S. H. Mannan D. C. Whalley A. O. Ogunjimi D. J. Williams Assembly of planar array components using anisotropic conducting adhesives̵A benchmark study: Part I̵Experiment IEEE Transactions on Electronics Packaging Manufacturing 19 4 264 269 October 1996 3476 12177 558553
2. A. O. Ogunjimi O. A. Boyle D. C. Whalley D. J. Williams A review of the impact of conductive adhesive technology on interconnection J. Electron. Manufact. 2 109 118 Sept. 1992
3. J. H. Lau Flip Chip Technologies 223 340 1996 McGraw-Hill New York 6𔂾
4. J. R. Scott Trans. Inst. Rubber Ind. 7 169 1931
5. S. H. Mannan D. C. Whalley A. O. Ogunjimi D. J. Williams Assembly of planar array components using anisotropic conducting adhesives̵A benchmark study Proc. Adhesives Electron.`96 270 284 1996 Stockholm
6. S. H. Mannan D. C. Whalley A. O. Ogunjimi D. J. Williams Modeling of the initial stages of the anisotropic adhesive joint assembly process Proc. 1995 Japan IEEE IEMTS 142 145 4‘ Dec. 1995 Omiya 4032 11576 541013