Characterisation of anisotropic conductive adhesive compression during: The assembly process

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 183-189

  Whalley, David C ^a   Kristiansen, Helge ^b   Liu, Johan ^c  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b SINTEF   (Norway)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CHEMICAL BONDS; COMPACTION; ELECTRIC RESISTANCE; FINITE ELEMENT METHOD; FLOW OF FLUIDS; RESINS; STIFFNESS; THERMOPLASTICS; ASSEMBLY; DATA COMPRESSION; ELECTRONICS PACKAGING;

ADHESIVE FLOWS; ASSEMBLY PRESSURE; ADHESIVE MATERIALS; ADHESIVE RESINS; ADHESIVE THICKNESS; ANISOTROPIC CONDUCTIVE ADHESIVES; ASSEMBLY PROCESS; BOND PAD; CHARACTERISATION; COMPRESSION PROCESS; CONDUCTIVE PARTICLE; CONTINUOUS MONITORING; CONTROLLED ASSEMBLY; DESIGN RULES; EXPERIMENTAL TECHNIQUES; RESIN CURE; RESIN FLOWS; VOICE COIL;

ADHESIVES; ADHESIVE JOINTS;

EID: 1242309805     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35238     Document Type: Conference Paper

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