Electrical conductive characteristics of ACA bonding: A review of the literature, current challenges and future prospects

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 264-276

  Dou, Guangbin ^a   Whalley, David C ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; DEFORMATION; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; LIQUID CRYSTAL DISPLAYS; MATHEMATICAL MODELS; SOLDERED JOINTS;

ADHESIVE MATRICES; ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); METALLURGICAL BONDS; PARTICLE DEFORMATION;

ELECTRONICS PACKAGING;

EID: 14844334204     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)

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