Computational modelling of the anisotropic conductive adhesive assembly process

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 393-398

  Whalley, D C ^a   Glinsky, G ^b   Bailey, C ^b   Liu, J ^c  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ANISOTROPY; ASSEMBLY; CHIP SCALE PACKAGES; COMPUTATION THEORY; COMPUTATIONAL FLUID DYNAMICS; COMPUTATIONAL GEOMETRY; ELECTRONICS PACKAGING; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; RESINS; SHEAR FLOW; SHEAR THINNING; SUBSTRATES;

ADHESIVE MATERIALS; ANISOTROPIC CONDUCTIVE ADHESIVES; COMPUTATIONAL FLUID DYNAMICS MODELS; COMPUTATIONAL MODEL; COMPUTATIONAL MODELLING; CONDUCTIVE PARTICLE; SUBSTRATE MATERIAL; TEMPERATURE DEPENDENT;

NON NEWTONIAN FLOW;

EID: 1242351560     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.984016     Document Type: Conference Paper

References (11)

1. Williams D.J. and Whalley, D.C., "The effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives - non uniform conductivity and shorting between connections" Journal of Electronic Manufacturing, Vol. 3 (1993), pp. 85-94
2. Liu, J., "ACA bonding technology for low cost electronics packaging applications - current status and remaining challenges" Soldering and Surface Mount Technology, Vol. 13, No. 3 (2001), pp. 39-57
3. Ogunjimi, A. O., Mannan, S. H., Whalley, D. C. and Williams, D. J., "The assembly process for anisotropic conductive joints - some new experimental and theoretical results", Journal of Electronic Manufacturing, Vol. 5 (1995), pp. 263-272
4. Mannan, S.H., Whalley, D.C., Ogunjimi, A.O., and Williams, D. J., "Assembly of planar array components using anisotropic conducting adhesives - a benchmark study: Part II - Theory" IEEE Transactions on Components, Packaging and Manufacturing Technology - Part C, Vol. 19 (1996), pp. 264-269
5. Dudek, R., Meinel, S., Schubert, A., Michel, B., Dorfmüller, L., Knoll, P.M. and Baumbach, J., "Flow characterization and thermo-mechanical response of anisotropic conductive films"" IEEE Transactions on Components and Packaging Technology, Vol. 22 (1999), 177-185
6. Mannan, S.H., Williams, D.J. and Whalley, D.C., "Some Optimum Anisotropic Conductive Adhesive Properties for Flip Chip Interconnection", Journal of Materials Science: Materials in Electronics, Vol. 8 (1997), pp. 223-231
7. D. C. Whalley, L. Chen and J. Liu "Modelling of the Anisotropic Adhesive Assembly Process" Proceedings of the Fourth International Symposium on Electronic Packaging Technology, Beijing, August 2001, pp. 319-324, ISBN 0-7803-9811-4
8. Buratynski, E.K., "Thermomechanical modelling of direct chip interconnection assembly", Journal of Electronic Packaging Vol. 115 (1993), pp. 382-391
9. Chiang, K.N., Chang, C.W. and Lin, J.D., "Analysis of ACA/ACF Package Using Equivalent Spring Method" IEEE Electronics Packaging Technology Conference, Singapore, 2000, pp. 110-116
10. Wu, C.M.L., Liu, J. and Yeung, N.H., "The effects of bump height on the reliability of ACF in flip-chip" Soldering and Surface Mount Technology, Vol. 13 (2001), pp. 25-30
11. Gustafsson, K., Mannan, S.H., Lai, Z., Liu, J., Whalley, D.C. & Williams, D.J., "The Effect Of Temperature Ramp Rate On Flip-chip Joint Quality And Reliability Using Anisotropic Conductive Adhesive On FR-4 Substrate" Proceedings of the 47th Electronic Components and Technology Conference, San Jose, 1997, pp. 561-566