Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarization

Electrochemical and Solid-State Letters

Volumn 10, Issue 1, 2007, Pages

  Lin, Jeng Yu ^a   Wang, Yung Yun ^a   Wan, Chi Chao ^a,c   Feng, Hsien Ping ^a,b   Cheng, Min Yuan ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION; DEFECTS; POLARIZATION; SECONDARY ION MASS SPECTROMETRY; TANTALUM COMPOUNDS;

CHEMICAL MECHANICAL PLANARIZATION; GALVANIC CORROSION; POTENTIODYNAMIC POLARIZATION;

INTERFACES (MATERIALS);

EID: 33845359615     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2364309     Document Type: Article

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