A study of formation and failure mechanism of CMP scratch induced defects on ILD in a W-damascene interconnect SRAM cell

IEEE International Reliability Physics Symposium Proceedings

Volumn 2001-January, Issue , 2001, Pages 42-47

  Jung, Soon Moon ^a   Uom, Jung Sup ^a   Cho, Won Suek ^a   Bae, Yong Joon ^a   Chung, Yeon Kyu ^a   Yu, Kwang Suk ^a   Kim, Kil Yeon ^a   Kim, Kyung Tae ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Abrasives; Chemical technology; Dielectric breakdown; Failure analysis; Life estimation; Planarization; Random access memory; Slurries; Stress; Testing

Indexed keywords

ABRASIVES; CHEMICAL ANALYSIS; DEFECTS; DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN; ELECTRIC FIELDS; FAILURE ANALYSIS; INTEGRATED CIRCUIT INTERCONNECTS; OUTAGES; RANDOM ACCESS STORAGE; RELIABILITY; SLURRIES; STATIC RANDOM ACCESS STORAGE; STRESSES; TESTING;

CHEMICAL TECHNOLOGIES; ELECTRIC FIELD STRESS; HIGH TEMPERATURE OPERATING LIVES; LIFE ESTIMATION; PLANARIZATION; RANDOM ACCESS MEMORY; RELIABILITY FAILURE; TIME DEPENDENT DIELECTRIC BREAKDOWN;

FAILURE (MECHANICAL);

EID: 84949748563     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2001.922879     Document Type: Conference Paper

References (4)

1. Kathleen A. Perry "Chemical polishing: the impact of a new technology on an industry".,Symposium on VLSI Technology, 1998. Digest of Technical Papers, pp 2-5.
2. Gerd Nanz and Lawrence E. Camilletti "Modeling of Chemical-Mechanical Polishing A Review", IEEE Transactions on Semiconductor Manufacturing, 1995, Vol.8, No.4, pp 382-389.
3. Aaron L. Swecker, Andrzej J. Strojwas, Xiaolei Li, Ady Levy and Bobby Bell "Optimization of CMP defect detection schemes", Semiconductor Manufacturing Conf. Proceedings, 1997, pp E-39-E42.
4. Ichirou Moriyama, Yoshikazu Tanabe, Ichirou Ishimaru, Minori Noguchi, Koichiro Mizukami, "Surface Inspection System with Automatic Discrimination of Microscratches and Particles on Chemical Mechanical Polished Wafers", Semiconductor Manufacturing Conf. Proceedings, 1999, pp139-142.