Assembly issues in three flip chip processes

Microelectronics International

Volumn 17, Issue 2, 2000, Pages 15-18

  Zhong, Zhaowei ^a  

^a NONE

Author keywords

Adhesives; Bonding; Flip chip; Stud bump bonding; Underfill

Indexed keywords

EID: 0042783231     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360010332390     Document Type: Article

References (8)

1. Gamota, D.R. and Melton, C.M. (1997), "Advanced flip chip materials: reflowable underfill systems", Advances in Electronic Packaging, EEP-Vol. 19-1, pp. 365-71.
2. Kloeser, J., Kutzner, K. and Gross, K. (1997), "A new production line for low cost flip chip assembly", Proceedings of the Technical Program, Surface Mount Intenational, USA, pp. 257-66.
3. Lau, J.H. (1995), Flip Chip Technologies, McGraw-Hill, New York. NY.
4. Ross, P.J. (1988) Taguchi Techniques for Quality Engineering. McGraw-Hill Book Company, New York, NY.
5. Wong, C.P., Shi, S.H. and Jefferson, G. (1997), 'High performance no flow underfills for low-cost flip-chip applications", Proceedings of 1997 Electronic Components and Technology Conference, pp. 850-8.
6. Zhong, Z.W. (1999), "Assembly and reliability of flip chip on hoards using ACAs or eutectic solder with underfill", Microelectronics International, Journal of The Microelectronics and Packaging Society - Europe, Vol. 16 No. 3, pp. 6-14.
7. Zhong, Z.W. and Goh, K.S. (1999), "Assembly and reliability of flip chip on various substrate materials", Proceedings of 1st International Workshop on Electronics Materials and Packaging (EMAP '99), Singapore, pp, 12-20.
8. Zhong, Z.W., Wong, S. and Nishikawa, T. (1997), "A study of flip chip on board mounting process using anisotropic conductive films", Proceedings of SEMICON Test, Assembly and Packaging 97. Singapore, pp. 157-64.