Lead-free solder evaluation for ball attaché process

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 6-10

  Anand, A ^a   Mui, Y C ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; INTERFACE STATES; INTERFACES (MATERIALS); INTERMETALLICS; LEAD ALLOYS; LEAD-FREE SOLDERS; NICKEL; PRINTED CIRCUIT BOARDS; PROCESSING; SOLDERED JOINTS; TIN ALLOYS;

ASSEMBLY LINE; LEAD-FREE ALLOY; LIFE PERFORMANCE; LOW PROCESSING TEMPERATURE; PROCESS TEMPERATURE; SOLDER ALLOYS; SOLID-STATE DIFFUSION; TIN LEAD ALLOYS;

TIN;

EID: 27644448255     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185588     Document Type: Conference Paper

References (8)

1. An Intermetallic study of solder joints with Sn-Ag-Cu lead free solder. CF Chan(Motorola) S.K lahri(SMA).Pyuan(Motorola)& JBHhow
2. Reactions between Sn/Ag/Cu lead-free solders and Ni bearing surface finish in Advanced Electronic Packages' Lc Shiau, C.E HO, C.Robert Kao. APAC 2001.
3. "Creep of Pb-free solders" by FayHua, C Michael Garner Intel corporation, HG Song, JW Morris University of california.
4. 'Physical and Mechanical properties of Intermetallic compounds commonly found in solder joints' by RJ Fields and SR Low, NIST.
5. 'Effects of lead contamination on Eutectic Sn-Ag solder joint' by S.Choi & team from Michigan state university.
6. 'Effect of Cu in Pb free solder ball on the microstructure of BGA joints With Au/Ni coated Cu pads' by Keisuke Uenishi & team.
7. Effect of Ag addition on the microstructural and mechanical properties of Sn-Cu eutectic solder' Seok-Hwan Huh, Keun-soo Kim, & Katsuaki Suganuma.
8. 'Impact of Intermetallic growth on mechanical strength of lead-free assembly' by Patrick Roubaud & team presented at IPC SMEMA council 2001.