Formation and growth of intermetallics in thermosonic wire bonds: Significance of vacancy-solute binding energy

Journal of Alloys and Compounds

Volumn 426, Issue 1-2, 2006, Pages 200-204

  Murali, S ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Diffusion; Intermetallics; Point defects

Indexed keywords

BINDING ENERGY; CRYSTAL ATOMIC STRUCTURE; CRYSTAL GROWTH; ELECTRONICS PACKAGING; MICROELECTRONICS; POINT DEFECTS;

ATOMIC RADII; INTER DIFFUSION COUPLE; THERMOSONIC BONDING; VACANCY-SOLUTE BINDING ENERGY;

INTERMETALLICS;

EID: 33751016352     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.08.052     Document Type: Article

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