Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds

Materials Letters

Volumn 58, Issue 25, 2004, Pages 3096-3101

  Murali, S ^a   Srikanth, N ^a   Vath III, Charles J ^a  

^a ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

Diffusion; Gold aluminide; Intermetallic phase; Kirkendall void; Thermosonic wire bonding

Indexed keywords

GOLD ALUMINIDE; INTERMETALLIC PHASES; KIRKENDALL VOIDS; THERMAL AGING; THERMOSONIC WIRE BONDING;

ENERGY DISPERSIVE SPECTROSCOPY; HIGH TEMPERATURE EFFECTS; INTERDIFFUSION (SOLIDS); INTERMETALLICS; METALLIZING; METALLURGY; MORPHOLOGY; PACKAGING; PRODUCT DESIGN; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; WIRE PRODUCTS;

MICROELECTRONICS;

EID: 4344598217     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.05.070     Document Type: Article

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