Mechanical and electrical properties of Au-Al and Cu-Al intermetallics layer at wire bonding interface

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 617-620

  Wei, Tan Chee ^a,b   Daud, Abdul Razak ^a  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^b ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BONDING; COPPER ALLOYS; DEGRADATION; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; GOLD ALLOYS; HARDNESS; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; MECHANICAL TESTING; THICKNESS MEASUREMENT;

COPPER ALUMINUM ALLOYS; GOLD ALUMINUM ALLOYS; INTERFACIAL SHEAR FORCE; THERMAL AGING TEST; THERMOSONIC COPPER WIRE BONDING;

INTERMETALLICS;

EID: 0347567444     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604809     Document Type: Article

References (9)

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