Thermal degradation of joined thick Au and Al elements

Microelectronics International

Volumn 21, Issue 1, 2004, Pages

  Bochenek, A ^a   Bober, B ^a   Hauffe, W ^b   Lukaszewicz, M ^a   Langer, E ^b  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Electrical resistivity; Thermal efficiency

Indexed keywords

EID: 1242338187     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360410517102     Document Type: Article

References (10)