Gold and aluminum wire bonding to palladium surface finishes

Circuit World

Volumn 25, Issue 3, 1999, Pages 23-27

  Fan, Chonglun ^a   Abys, Joseph A ^a   Blair, Alan ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; ELECTROPLATING; GOLD; PALLADIUM;

WIRE BONDING;

PRINTED CIRCUIT BOARDS;

EID: 0032653833     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129910269007     Document Type: Article

References (10)

1. Abbott, D.C., Brook, R.M., McLelland, N. and Wiley, J.S. (1991), "Palladium as a lead finish for surface mount integrated circuit packages", IEEE Trans. on Components, Hybrids, and Mfg. Technol., Vol. 14 No. 3, September, p. 567.
2. Abys, J.A., Kadija, I.V., Kudrak, E.J. and Maisano, J.J. (1994), US Patent 5,360,991.
3. Baker, H. (Ed.) (1992), ASM Handbook, ASM International, Materials Park, OH, Vol. 3, Alloy Phase Diagrams, pp. 2.73-2.74 and 2.314.
4. DiBari, G.A. (1996), "Nickel plating", in Murphy, M. (Ed.), Metal Finishing Guidebook, Vol. 94, No. 1 A, Elsevier Science Inc., New York, p. 251.
5. Fan, C., Kadija, I.V., Abys, J.A. and Maisano, J.J. (1997a). "Specific multilayer surface finishes for leadframe applications", in Datta, M., Fenton, J.M. and Brooman, E.W. (Eds), Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology: Applications in Electronics, The Electrochemical Society Proceeding Series, PV 96-21, p. 188.
6. Fan, C., Kadija, I.V., Abys, J.A. and Maisano, J.J. (1997b), "Ductile nickel/palladium multilayer surface finishes designed for leadframe packaging", Proceedings of the 84th AESF Annual Technical Conference, p. 277.
7. Harman, G. (1997a), Wire Bonding in Microelectronics, 2nd edition, McGraw-Hill, New York, NY, p. 148.
8. Harman, G. (1997b), Wire Bonding in Microelectronics, 2nd edition, McGraw-Hill, New York, NY, pp. 50-1.
9. Kadija, I.V., Abys, J.A., Maisano, J.J., Kudrak, E.J. and Shimada, S. (1995). "Thin multilayer palladium coatings for semiconductor packaging applications", Plat. and Surf. Fin., Vol. 82 No. 2, February, p. 56.
10. Trigwell, S. (1993), "Failure mechanisms of wire and die bonding", Solid State Technology, Vol. 36 No. 5, May, p. 45.