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Volumn 63, Issue 7, 1999, Pages 828-837
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Intermetallic growth and void formation in Au wire ball bonds to Al pads
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
ALUMINUM;
ANNEALING;
BOND STRENGTH (MATERIALS);
DIFFUSION IN SOLIDS;
INTERFACES (MATERIALS);
INTERMETALLICS;
THIN FILMS;
WIRE BONDING;
GOLD ALLOYS;
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EID: 0032627145
PISSN: 00214876
EISSN: None
Source Type: Journal
DOI: 10.2320/jinstmet1952.63.7_828 Document Type: Article |
Times cited : (12)
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References (18)
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