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Volumn 63, Issue 7, 1999, Pages 828-837

Intermetallic growth and void formation in Au wire ball bonds to Al pads

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINUM; ANNEALING; BOND STRENGTH (MATERIALS); DIFFUSION IN SOLIDS; INTERFACES (MATERIALS); INTERMETALLICS; THIN FILMS;

EID: 0032627145     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet1952.63.7_828     Document Type: Article
Times cited : (12)

References (18)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.