Effect of metallization on the lifetime prediction of mechanically stressed Low-Temperature Co-Fired Ceramics multilayers

Journal of the American Ceramic Society

Volumn 88, Issue 8, 2005, Pages 2188-2194

  Dannheim, Henning ^a   Roosen, Andreas ^a,c   Schmid, Ulrich ^b  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^b AIRBUS GROUP INNOVATIONS   (Germany)

^c AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC LAYOUT; LOW-TEMPERATURE CO-FIRED CERAMICS (LTCC); MASS FLOW SENSORS; MECHANICAL STRESSES;

BENDING STRENGTH; CRACK INITIATION; ELECTRONIC EQUIPMENT MANUFACTURE; LOW TEMPERATURE EFFECTS; METALLIZING; MULTILAYERS; SENSORS; STRESS ANALYSIS; STRESSES;

CERAMIC MATERIALS;

EID: 27644518286     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00403.x     Document Type: Article

References (20)

1. Proceedings of the 35th International Symposium on Microelectronics, Denver, CO. IMAP Society, Washington, DC, 2002.
2. K. G. Ewsuk, "Ceramic-Filled-Glass Composite Sintering," Ceram. Trans., 15, 279-95 (1990).
3. K. Kata, Y. Shimada, and H. Takamizawa, "Low Dielectric Constant New Materials for Multilayer Ceramic Substrate," IEEE Trans. Compon. Hybrids Manuf. Technol., 13, 448-51 (1990).
4. R. R. Tummala, "Ceramic and Glass-Ceramic Packaging in the 1990s," J. Am. Ceram. Soc., 74, 895-908 (1991).
5. J. U. Knickerbocker, "Overview of the Glass-Ceramic/Copper Substrate - A High-Performance Multilayer Package for the 1990s," Am. Ceram. Soc. Bull., 72, 1393-401 (1992).
6. S. H. Knickerbocker, A. H. Kumar, and L. W. Herron, "Cordierite Glass-Ceramics for Multilayer Ceramic Packaging," Am. Ceram. Soc. Bull., 72, 90-5 (1993).
7. O. Dernovsek, A. Naeini, G. Preu, W. Wersing, M. Eberstein, and W. A. Schiller, "LTCC Glass-Ceramic Composites for Microwave Application," J. Eur. Ceram. Soc., 21, 1693-7 (2001).
8. D. I. Amey, M. Y. Keating, M. A. Smith, S. J. Horowitz, P. C. Doahue, and C. R. Needs, "Low Loss Tape Materials System for 10 to 40 GHz Application"; pp. 654-8 in Proceedings of the International Symposium on Microelectronics, Boston, MA, September 2000.
9. A. H. Feingold, M. Heinz, and R. L. Wahlers, "Compliant Dielectric and Magnetic Materials for Buried Components"; pp. 65-70 in Proceedings of the International Symposium on Microelectronics. Denver, CO, September 2002.
10. D. L. Wilcox, "Multilayer Ceramic Microsystems Technology - An Overview"; pp. 115-7 in Proceedings of the European Microelectronic and Packaging Conference 2001, IMAPS France, Versailles, 2001.
11. H. Dannheim, U. Schmid, and A. Roosen, "Lifetime Prediction of Mechanically Stressed Low Temperature Co-Fired Ceramics," J. Eur. Ceram. Soc., 24, 2187-92 (2004).
12. DuPont Photopolymer & Electronic Materials, 951 Low-Temperature Co-Fired Dielectric Tape, Du Pont (U.K.) Limited, Bristol, U.K., 1998.
13. U. Schmid, "Theoretical and Experimental Investigations of a Novel Hot Film Anemometer for High Pressure Automotive Applications," IEEE Sensor J., 3 [2] 229-40 (2003).
14. U. Schmid, "Determination of Fuel Quantities with a Micromachined Injection Rate Sensor"; pp. 323-37 in Proceedings of the 7th Conference on Advanced Microsystems for Automotive Applications (AMAA). Edited by J. Valldorf and W. Gessner, Springer Press, Berlin, 2003.
15. U. Schmid, "Robuste Flusssensorik für automobile Hochdruckeinspritz-systeme"; Ph.D. Thesis (in German), published under "Selected Topics of Electronics and Micromechatronics," Technical University of Munich, 2003.
16. D. Munz and T. Fett, Ceramics: Mechanical Properties, Failure Behaviour, Materials Selection. Springer-Verlag, Berlin, Germany, 2001.
17. D. K. Shetty, A. R. Rosenfield, P. McGuire, G. K. Bansal, and W. H. Duck-worth, "Biaxial Flexural Tests for Ceramics," Am, Ceram. Soc. Bull., 59, 1193-7 (1980).
18. R. Danzer, T. Lube, and P. Supancic, "Monte Carlo Simulations of Strength Distributions of Brittle Materials," Z. Metallkunde, 92, 773-83 (2001).
19. ENV 843-5, Advanced Technical Ceramic, Mechanical Properties at Room Temperature. Part S: Statistical Analysis. European Standard, 1996.
20. H. Hartmann, "Crystallizable, Low Dielectric Constant, Low Dielectric Loss Composition"; European Patent Application by DuPont, 0 423 751 A2, 1990.