Investigation of interfacial fracture behavior of a flip-chip package under a constant concentrated load

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 1, 1998, Pages 79-85

  Wang, Jianjun ^b   Lu, Minfu ^b   Zou, Daqing ^b   Liu, Sheng ^a,b  

^a IEEE   (United States)

^b Wayne State University   (United States)

Author keywords

Crack growth rate; Energy release rate; Finite element analysis; Flip chip package; Interfacial fracture toughness; Moir interferometry; Phase angle

Indexed keywords

CRACK PROPAGATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE MECHANICS; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); INTERFEROMETRY; SEMICONDUCTING SILICON;

ENERGY RELEASE RATE; MOIRE INTERFEROMETRY;

ELECTRONICS PACKAGING;

EID: 0031999316     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.659510     Document Type: Article

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