Potential failure sites in a flip-chip package with and without underfill

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 4, 1998, Pages 336-341

  Madenci, E ^a   Shkarayev, S ^a   Mahajan, R ^b  

^a University of Arizona   (United States)

^b Inlel Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; STRAIN; STRESS ANALYSIS; STRESS CONCENTRATION;

STRAIN ENERGY DENSITY CRITERION; UNDERFILL;

ELECTRONICS PACKAGING;

EID: 0032304121     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792643     Document Type: Article

References (9)

1. Jackson, R., and Carnevaii, P., 1991, “Finite Element Modeling of Encapsulated Flip-Chip Packaging Assemblies,”Proceedings 1991 International Symposium on Microelectronics, ISHM, pp. 82-85.
2. Le Gall, A. C., Jianmin, Q., and McDowell, D. L., 1996, “Delamination Cracking in Encapsulated Flip Chips,” 46th Electronic Components and Technology Conference Proceedings, IEEE, Piscataway, NJ, pp. 430-434.
3. Madenci, E., Shkarayev, S., and Sergeev B., 1998, “Thermo-Mechanical Systems in Regions of Dissimilar Materials via Global-Local Finite Element Analysis,” Theoretical and Applied Fracture Mechanics, in press.
4. Munz, D., Fett, T., and Yang, Y. Y., 1993, “The Regular Stress Termin Bonded Dissimilar Materials After a Change in Temperature,”Engineering Fracture Mechanics, Vol. 44, pp. 185-194.
5. Persson, E., Madenci, E., and Ericksson, I., 1998, “Prediction of Delamination Initiation in Laminates with Pin-Loaded Holes,” Theoretical and Applied Fracture Mechanics, in press.
6. Sih, G. C., and Chen, E. P., 1981, Cracks in Composite Materials, Vol. 6 in Mechanics of Fractures, Martinus Nijhoff Publishers, The Hague. Vol. 6.
7. Sih, G. C., and MacDonald, B., 1974, “Fracture Mechanics Applied to Engineering Problems—Strain Energy Density Criterion,”Engineering Fracture Mechanics, Vol. 6, pp. 361-386.
8. Sih, G. C., Michopoulos, J. G., and Chou, S. C., 1986, Hygrothermoelasticity, Martinus Nijhoff Publishers, The Hague.
9. Williams, M. L., 1952, “Stress Singularities Resulting From Various Boundary Conditions in Angular Corners of Plates in Extension,”ASME Journal of Applied Mechanics, Vol. 60, pp. 93-100.