Effect of thermal residual stresses on the apparent interfacial fracture toughness of polymer/metal interface

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 365-368

  Yao, Qizhou ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM; CRACKS; ELASTICITY; EPOXY RESINS; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); RESIDUAL STRESSES; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS;

COEFFICIENT OF THERMAL EXPANSION; EPOXY BASED POLYMERIC ADHESIVES; THERMAL RESIDUAL STRESSES;

ELECTRONICS PACKAGING;

EID: 0032657594     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)