Improved bonding pad design for fluxless flip chip bonding process and low fracture strength substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1701-1704

  Bonda, Rao ^a   Guo, Yifan ^a   Stafford, John ^a   Swan, Geoff ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; FLIP CHIP DEVICES; FLUXES; FRACTURE TOUGHNESS; METALLIZING; MULTICHIP MODULES; PASSIVATION; RELIABILITY; STRESSES;

BENZOCYCLOBUTCHE; FLUXLESS FLIP CHIP BONDING;

BONDING;

EID: 0034476694     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)