Extending the limits of air-cooling in microelectronic equipment

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 695-702

  Rodgers, Peter ^a   Eveloy, Valérie ^a   Pecht, Michael G ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; HEAT SINKS; INTERFACES (MATERIALS); SYSTEMS ANALYSIS;

HEAT SINK SURFACE FOULING; HEAT SPREADING; HYBRID THERMAL MANAGEMENT; MICROELECTRONIC EQUIPMENTS;

MICROELECTRONICS;

EID: 33745712097     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502891     Document Type: Conference Paper

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