Thermal behavior of a soldered Cu-Si interface

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 46-49

  Van Heerden, D ^a   Rude, T ^a   Newson, J ^a   Knio, O ^a   Weihs, T P ^a   Gailus, D W ^b  

^a Reactive Nano Technologies Inc   (United States)

^b Aavid Thermalloy   (United States)

Author keywords

Direct Die Attach; Heat Sink Mounting; Reactive Joining; Thermal Interface Materials

Indexed keywords

DIRECT DIE ATTACH; HEAT SINK MOUNTING; REACTIVE JOINING; THERMAL INTERFACE MATERIALS;

EUTECTICS; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); MULTILAYERS; NANOSTRUCTURED MATERIALS; SILICON; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EFFECTS;

COPPER;

EID: 2342587311     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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2. T.W. Barbee, Jr. and T.P. Weihs, "Ignitable, Heterogeneous, Stratified Structures for the Propagation of an Internal Exothermic, Chemical reaction along an Expanding Wavefront," U.S. Patent 5,538,795, 1996.
3. T.W. Barbee, Jr. and T.P. Weihs, "Method for Fabricating an Ignitable, Heterogeneous, Stratified Structure," U.S. Patent 5,547,715, 1996.
4. T. P. Weihs, "Self-Propagating Reactions in Multilayer Materials," chapter in "Handbook of Thin Film Process Technology," edited by D.A. Glocker and S.I. Shah, IOP Publishing, 1998.
5. A.J. Gavens, D.Van Heerden, A.B. Mann, M.E. Reiss, and T.P. Weihs, "Effect of Intermixing on Self-Propagating Exothermic Reactions in AIM Nanolaminate Foils," Journal of Applied Physics, 87, 1255-1263 (2000).
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7. A.B. Mann, A.J. Gavens, M. Reiss, D. van Heerden, G. Bao, and T.P. Weihs, "Predicting the Characteristics of Self-Propagating Exothermic Reactions in Multilayer Foils," Journal of Applied Physics, 82, 1178-1188 (1997).
8. S. Jayaraman, A.B. Mann, M. E. Reiss, T.P. Weihs, and O.M. Knio, "Numerical Study of the Effect of Heat Losses on Self-Propagating Reactions in Multilayer Foils," Combustion and Flame, 124, 178-194 (2000).
9. E. Besnoin, S. Cerutti, O.M. Knio, and T.P. Weihs, "Effect of Reactant and Product Melting on Self-Propagating Reactions in Multilayer Foils", J. Appl. Phys. 92, 5474-5481 (2002).
10. D. Van Heerden, O.M. Knio, and T.P. Weihs, "A Ten Fold Reduction in Interface Thermal Resistance for Heat Sink Mounting," Proceedings of IMAPS 2003 Symposium, in press.
11. A. Duckham, E. Besnoin, S. J. Spey, J. Wang, M.E. Reiss, O. M. Knio, M. Powers, M. Whitener, T. P. Weihs, "Reactive Nanostructured Foil used as a Heat Source for Joining Titanium" J. App. Phys., Submited.
12. J. Wang, E. Besnoin, A. Dukham, S. J. Spey, M.E. Reiss, O. M. Knio, M. Powers, M. Whitener, T. P. Weihs "Room-temperature soldering with nanostructured foils," App. Phys. Lett., Vol. 83, No. 19. pp. 3987-3839, 2003.
13. J. Wang, E. Besnoin, A. Dukham, S. J. Spey, M.E. Reiss, O. M. Knio, T. P. Weihs "Joining of stainless-steel specimens with nanostructured Al/Ni foils," J. App. Phys., Vol. 95, No. 1. pp. 248-256, 2004.