Noise and cooling in electronics packages

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 154-160

  Lyon, Richard H ^a   Bergles, Arthur E ^b  

^a RH Lyon Corp   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC NOISE; COOLING SYSTEMS; ELECTRONIC EQUIPMENT; FANS; HEAT TRANSFER; NATURAL CONVECTION; PIPE FLOW; REYNOLDS NUMBER; TURBULENT FLOW;

ELECTRONIC PACKAGES; FAN NOISE; FLOW CONDITIONS; IRREDUCIBLE NOISE;

ELECTRONICS PACKAGING;

EID: 2342508314     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Gordon, C. G.; "Spoiler-Generated Flow Noise I The Experiment" J. Acoust Soc. Am. Vol 43, No. 5 May 1968, pp 1041-1048 "Spoiler Generated Noise II - Results" J. Acoust. Soc. Am., vol. 45, No. 1, January 1969, pp 214-223
2. Gordon, C. G.; "Spoiler-Generated Flow Noise I The Experiment" J. Acoust Soc. Am. Vol 43, No. 5 May 1968, pp 1041-1048 "Spoiler Generated Noise II - Results" J. Acoust. Soc. Am., vol. 45, No. 1, January 1969, pp 214-223
3. Noise Reduction, Ed. L. L. Beranek (McGraw-Hill Book Co., Inc.New York, 1960), p 545.
4. McAdams, W. H.; Heat Transmission 3rd Edition (McGraw-Hill Book Co., Inc, 1954), p 219.
5. Anderson, A. M. and Moffat, R. J.; A New Type of Heat Transfer Correlation for Air Cooling of Electronic Components", ASME HTD-vol 153, (ASME, New York, 1990) pp 27-39
6. Moffat, R. J.; Personal communication, Stanford University, November 16, 2003.
7. Simons, R. E.; Personal communication, IBM Corporation, December 24, 2003.
8. Norton, M. P.; Fundamentals of Noise and Vibration Analysis for Engineers (Cambridge University Press, Cambridge UK 1989) pp 130 ff.
9. Lyon, R. H.; Random Noise and Vibration in Space Vehicles, (SVIC, DoD 1967), Section 2.2