Extending the limits of air cooling with thermoelectrically enhanced heat sinks

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 679-684

  Bierschenk, Jim ^a   Johnson, Dwight ^a  

^a Marlow Industries Inc   (United States)

Author keywords

Electronics Cooling; Refrigeration; TEC; Thermoelectric

Indexed keywords

AIR COOLING; ELECTRONICS COOLING; PELTIER HEAT PUMPING; THERMOELECTRIC COOLERS (TECS);

COOLING; ELECTRONIC EQUIPMENT; HEAT PUMP SYSTEMS; HEAT RESISTANCE; HEAT SINKS; HEATING; MICROELECTRONICS; REFRIGERATION; THERMAL EFFECTS;

THERMOELECTRICITY;

EID: 4444340187     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Goldsmid, H.J., Electronic Refrigeration, Pion Limited, London 1985.
2. Goldsmid, H.J., "Thermoelectric Cooling of Bodies at Above Ambient Temperatures," 4th International Conference on Thermoelectrics, p. 134, 1982.
3. th International Conference on Thermoelectrics, pp. 270-279, 1999.
4. Phelan, E.P., Chiriac, V.A., Lee, T-Y, "Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics," IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 3, pp 356-365, 2002.
5. Phelan, E.P., Chiriac, V.A., Lee, T-Y, "Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging," Interpack 2003.
6. Solbrekkan, G.L., Yazawa, K., Bar-Cohen, A., "Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices," Interpack, 2003.
7. "Assembly and Packaging," International Technology Roadmap for Semiconductors, 2001 ed: Semiconductor Industry Association, 2001.
8. Hylan B Lyon, Jr., PhD., Marlow Industries, Inc. web page article: http://www.marlow.com/AboutMarlow/advanced_materials.htm