Room temperature soldering of microelectronic components for enhanced thermal performance

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 681-686

  Subramanian, J S ^a   Rodgers, P ^b   Newson, J ^a   Rude, T ^a   He, Z ^a   Besnoin, E ^a   Weihs, T P ^a   Eveloy, V ^b   Pecht, M ^b  

^a Reactive NanoTechnologies   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CENTRAL PROCESSING UNIT (CPU); REACTIVE MULTILAYER FOILS; SEMICONDUCTOR DIE-TO-HEAT SPREADER; SOLDER JOINTS;

CRACK INITIATION; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); SEMICONDUCTOR MATERIALS; SOLDERING; THERMAL EFFECTS;

MICROELECTRONICS;

EID: 33745698077     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502888     Document Type: Conference Paper

References (19)

1. International Electronics Manufacturing Initiative (iNEMI) 2004 Technology Roadmap, http://www.nemi.org/cms/roadmapping.
2. Nakayama, W., and Bergles, A.E., "Thermal Interfacing Techniques for Electronic Equipment - A Perspective," Trans. ASME, Journal of Electronic packaging, Vol. 125, No. 2, 2003, pp. 192-199.
3. Lasance, C.J.M., "The Urgent Need for Widely-Accepted Test Methods for Thermal Interface Materials," Proc. 19th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003, pp. 123-128.
4. Mahajan, R., Chiu, C.P., and Prasher, R., "Thermal Interface Materials: a Brief Review of Design Characteristics and Materials," Electronics Cooling, Vol. 10, No. 1, 2004.
5. M. DeSorgo, "Thermal interface materials," Electronics Cooling, Vol. 2, No. 3, 1996.
6. D. Blazej, "Thermal interface materials," Electronics Cooling, Vol. 9, No. 4, 2003.
7. Viswanath, R., Wakharkar, V., Watwe, A., Lebonheur, V., "Thermal Performance Challenges from Silicon to Systems," Intel Technology Journal, Quarter 3, 2000.
8. Makowiecki D.M., and R.M. Bionta, "Low Temperature Reactive Bonding," US Patent 05381944, 1995.
9. Weihs, T.P., "Self-Propagating Reactions in Multilayer Materials," in Handbook of Thin Film Process Technology, edited by Glocker, D.A., and Shah, S.I., IOP Publishing, 1998.
10. Wang, J., Besnoin, E., Duckham, A., Spey, S.J., Reiss, M.E, Knio, O.M., Powers, M., Whitener, M., and Weihs, T.P., "Room-Temperature Soldering with Nanostructured Foils," Applied Physics Letters, Vol. 83 (19) November 2003.
11. Wang, J., Besnoin, E., Duckham, A., Spey, S.J., Reiss, M.E., Knio, O.M., and Weins, T.P.,"Joining of Stainless-Steel Specimens with Nanostructured Al/Ni foils", Journal, of Applied. Physics, Vol. 95, 2004, p. 248
12. Duckharn, A., Spey, S.J., Wang, J., Reiss, M.E., and Weihs, T.P., Besnoin, E., and Knio, O.M., "Reactive Nanostructured Foil Used as a Heat Source for Joining Titanium," Journal of Applied Physics, 96 (4), 2004
13. Wang, J., Besnoin, E., Knio, O.M., Weihs, T.P., Materialia, A., "Investigating the Effect of Applied Pressure on Reactive Multilayer Foil Joining," Acta Materialia, Vol. 52, 2004, pp. 5265-5274.
14. Cowan, "Pulse Method of Measuring Thermal Diffusivity at High Temperatures," Journal of Applied Physics, Vol. 34, 1963, pp. 926.
15. Parker et al., "Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity," Journal of Applied Physics, Vol. 32, 1961, pp. 1679.
16. Lee, T.R., "Thermal Diffusivity of Dispersed and Layered Composites," Purdue University, Ph.D. Thesis, University Microfilms International, 1977.
17. Campbell, R.C, and Smith, S.E., "Flash Diffusivity Method: A Survey of Capabilities," Electronics Cooling, Vol. 8, No. 2, 2002.
18. AMD Athlon™ 64 and AMD Opteron™ Processors Thermal Design Guide, http://www.amd.com/usen/assets/content_type/white_papers_and_tech_docs/ 26633_5649.pdf, pp. 26-27, Accessed January 30, 2004.
19. Cotterell, B., Chen, Z., Han, J.-B., Tan, N.-X., "The Strength of the Silicon Die in Flip-Chip Assemblies," Trans. ASME, Journal of Electronic Packaging, Vol. 125, No 1, 2003, pp. 114-119.